DiaSec Diamond Wafering Blade - General Purpose Metallography 4in Silicon Carbide with 240/P280 grit size

with 240/P280 grit size

The high viscosity formulation delivers excellent diamond retention on polishing cloths for improved abrasive utilization

The premium silicon carbide abrasive produces aggressive

Get 10/pkg and achieve precise specimen mounting

it delivers reliable

DiaSec Diamond Wafering Blade - General Purpose Metallography 4in Silicon Carbide with 240/P280 grit sizeThe DiaSec General Purpose Diamond Blade is a must have for metallurgical sample preparation. Made with metal bonding, this 4in x 0. 016in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 4in (100mm) Thickness: 0. 016in (0. 4mm) Arbor: 0. 5in (12. 7mm) Item No DS 1004 1 pkg